Developed especially for use with the ENVISION® DMS-E direct metallization process. Used prior to acid copper in pattern plate and panel applications. Compatible with dry film.

A modified, low foam version of AKTIPUR AS for use in horizontal, conveyorized equipment.

Acid copper cleaner designed to remove light soils, such as fingerprints in order to provide a clean water break surface. Formulated for use in either spray or immersion operations.

Acid-based spray cleaner removes chromate layers, sulfide film and oxides without attacking the copper surface.

Concentrated proprietary persulfate cleaner/microetch produces uniform, bright copper surfaces. Rinses easily and completely. Simple waste treatment.

Persulfate acid cleaner/microetch is rapid acting and very free rinsing in hot or cold water. Does not contain any glycol ether solvents.

Spray cleaner removes chromate-based conversion coatings, copper oxidation resulting form baking or storage, light shop soils and handling oils such as fingerprints. Low temperature operation allows for in-line horizontal processing.

Immersion acid cleaner provides same unique benefits as ENPLATE AD-488 spray cleaner.

Used as part of the ENPLATE AD-482 pattern plate cleaning system, ENPLATE AD-482 chelated formulation loosens and removes residual dry film binder materials, oils and light soils from copper substrates. Cleans copper traces without lifting or softening resists. Optimum copper-to-copper adhesion is assured.

Specifically designed to be used as a pre-cleaner prior to AlphaPREP PC-7025 coating on copper. It is a highly concentrated, strongly alkaline cleaner formulated to remove light organics and dry film residues. ENTHONE PC-7096 is suitable for spray , flood or dip applications and has a long bath life.

Aggressive, spray acid cleaner for the removal of oxides, fingerprints, anti-tarnish and chromate coatings from copper. Non-etching, rapid acting and free rinsing. Does not contain any glycol ether solvents.

Peroxide-free cleaner/adhesion promoter produces a unique copper grain structure. The resulting controlled surface topography is designed to form the ideal adhesion between copper and photoresists or solder masks. Offers superior adhesion and greater yields than conventional cleaning methods.

Concentrated alkaline stripper removes cured and uncured solder resists. May also be diluted as a cleaner for resist stripping and ink developer equipment.

Specially formulated to strip tin, tin-lead and copper from electroplating jigs by simple immersion at room temperature.

Concentrated alkaline cleaner developed for equipment cleaning and descaling applications. Extremely effective for cleaning resist stripping and developer units. Ideal for cleaning other types of equipment.

Liquid product formulated for cleaning the process chambers in HASL, developing or stripping equipment (dry film or liquid photoimageable resists).

Peroxide/sulfuric cleaner/microetch is suitable for spray and immersion applications. Ideally suited to prepare the copper surface prior to HASL or resist application (both liquid and dry film).

Persulfate-based, liquid copper conditioner removes chromate conversion film and provides uniform, roughened topography. Sold as ENTHONE PC-7036 in Asia.

Hydrogen peroxide/sulfuric acid microetch effectively inhibits hydrogen peroxide decomposition accelerated by copper ions and elevated operating temperatures. ENPLATE E-462 provides a controlled etch rate and is recyclable.

Concentrated proprietary persulfate cleaner/microetch produces uniform, bright copper surfaces. Rinses easily and completely. Simple waste treatment.

Persulfate acid cleaner/microetch is rapid acting and very free rinsing in hot or cold water. Does not contain any glycol ether solvents.

Monopersulfate-based, liquid microetch is ideal prior to HASL, and is also used as the pretreatment cleaner in the AlphaLEVEL™ organo-silver process.

Monopersulfate-based powder formulation features a high copper-holding capacity that generates superior microetch at greatly reduced operating costs. Yields superior surface topography suitable for optimum resist bonding. ENPLATE AD-485 is considered a critical step in the ENBOND® XTRA oxide process when delamination resistance and pink ring reduction are desired.

AlphaPREP PC-7030 is specially formulated for low etch/high capacity operations using horizontal equipment. The patented and environmentally friendly peroxide-sulfuric based chemistry produces an organo-metallic coating that delivers exceptional bonding performance between dielectric and copper at very low copper etch factors...

ENBOND MB-500 oxide produces oxide films with a crystal morphology…

AlphaPREP PC-7028 is exclusively formulated for vertical immersion operations. The high capacity system produces a highly bondable brown conversion coating on copper innerlayers using manual or automatic vertical equipment. The peroxide-sulfuric based process chemistry may be used in existing lines thus eliminating the need to purchase costly new equipment. AlphaPREP PC-7028 produces a textured, acid resistant surface that eliminates “pink ring” and provides a reliable copper-to-dielectric bond.

ENVISION MLB 2000 desmear/etchback process cleans and conditions small through-holes (less than 10 mils or 100µm)…

Single-step alkaline cleaner/conditioner for hole wall treatment. Extremely effective on hard-to –catalyze surfaces. Removes fingerprints and other light soils. Designed primarily for use on flex and rigid-flex substrates, it can also be used in mixed lines on double-sided or multilayer product.

Single-step alkaline cleaner/conditioner for hole wall treatment. Removes light soils, fingerprints and oxides from copper surfaces; conditions glass fiber and dielectric areas of double-sided and multilayer circuit board hole walls. Promotes enhanced palladium adsorption onto hole wall surfaces. Easy to rinse, it is particularly effective when used after the ENVISION 2000 etchback/desmear removal process.

Oxysulfate copper microetch is ideally suited to remove tarnish and oxidation from the copper surface. Yields optimum surface topography for excellent copper-to-copper adhesion.

Powder concentrate pre-dip is a high chloride, low acid replacement for acid pre-activation. Supplies chloride ions without increasing acidity; minimizes “pink ring” in multilayer processing.

Low acid concentration activator for through-hole plating is specially engineered for a highly active, extremely small palladium-tin species. The activator ensures complete and uniform palladium coverage on ALL dielectrics. Low concentration of palladium in the lowest acid media available minimizes lateral erosion and reduces operating costs. Extremely tolerant to contamination, yielding excellent stability and long solution life.

Fluoride-free post-activator ensures complete electroless copper coverage on glass fibers and all dielectrics. Effectively activates the palladium without inhibiting activator adhesion to glass fibers. Yields no voids and black holes in backlight test.

Low formaldehyde, high-build, EDTA-based copper deposits 1 – 1.5 microns of copper in 12 – 15 minutes or 2.0 – 2.5 microns of copper in 30 minutes. (Deposit thickness can be controlled by adjustment of the operating temperature.) Recommended for use over a wide operating range and loading conditions. Excellent in-tank stability; lowest formaldehyde level available; easily waste treatable.

Room temperature, low-build copper is used for flash-type plating. Yields fine, crystalline copper deposits of 0.5 – 1.0 microns in 30 minutes. Promotes the formation of smooth void-free electrodeposits. Ideal for intermittent, low loading conditions.

ENVISION HDI is a single-pass, direct metallization system that provides complete coverage of blind vias and high aspect ratio through-holes...

ENVISION DMS-E direct metallization systems selectively deposit highly conductive polymer…

Matte acid copper plating process produces fine crystalline, satin and ductile deposits. Specially formulated for PWBs with high aspect ratios. CUPROSTAR LP-1 acid copper affords simple operation for a single sulfur-free compound...

Sulfuric acid-based, matte tin process produces a dense, fine structured layer that is resistant to common etchants. Compatible with dry films.

Super throw, direct current, bright acid copper system designed to meet the distribution, thermal cycle and throwing power requirements of high aspect ratio through-holes and microvia PCB designs. The products provide a low cost alternative, yielding results similar to pulse periodic reverse plating systems…

Nickel processes produce slightly compressive or tensile stressed, semi-bright, ductile deposits. Available in sulfate and sulfamate formulations for use with soluble and insoluble anodes.

Soft gold process produces high purity, lemon-yellow gold deposits. Specifically designed to provide superior distribution for deep tank plating of COB technology. Fine grained deposit ensures consistent bonding results and uniform appearance. Exceptional distribution minimizes overplate and reduces gold usage. Low gold content in solution reduces precious metal inventory. Stable and controllable electrolyte is fully analyzable, reducing downtime and improving process control…

Cobalt-hardened gold process provides exceptional distribution. Extremely stable and controllable deposit performances yields reproducible final product. Completely analyzable, a low gold content reduces precious metal inventory, cuts drag-out and refining costs…

Nickel sulfamate plating solutions produce pure, ductile, fine grained, matte, low stress deposits. Easy to control and maintain.

Exhibits same unique benefits as PUR-A-GOLD 540.

Hydrogen peroxide-based tin and tin-lead stripper yields superior metal holding capacity for economical operation. Consistently maintains a high-speed stripping rate and low etch rate.

High speed, sulfate-based nickel electroplating process used with soluble and insoluble anodes. Produces slightly compressive or tensile stressed, semi-bright, ductile deposits.

High efficiency cobalt hardened gold plating process is optimized for high speed plating. Ideally suited for all types of selective plating.

Extremely stable and controllable electrolyte for consistent and reproducible final product. Completely analyzable, the gold is packaged for optimum stability and advanced process control. Used for all types of plating equipment. Low gold content reduces precious metal inventory, cuts drag-out and refining costs…

Stripper leaves a clean, bright and tarnish resistant finish on copper surfaces. Extremely economical due to its high metal capacity.

Nitric acid-based, peroxide-free strios tin or tin-lead deposit down to the copper tin intermetallic layer. PWB's may remain immersed without attack on the copper. Leaves exposed copper clean and bright.

No sludge, nitric acid based stripper removes plated and fused tin-lead. Excellent for selective solder stripping applications, as well as for removing fused solder from tabs for subsequent nickel and gold plating. Non-peroxide formulation contains no fluorides or fluorborates. Exothermic heat generation, white residues and “measling” of the laminate are eliminated.

Nitric acid based stripper provides ultra-low copper attack. Contains no fluoride, fluorborate, peroxide or thiourea. Features a high loading capacity, fast stripping speed, and sludge-free operation.

Complexer-free, low cost nitric acid based stripper. Contains no fluoride, fluorborate, peroxide or chelates.

Concentrated alkali-based stripper for removing cured UV and photoimageable solder resists. Fast acting without attacking epoxy laminate. Free rinsing in warm or cold water.

High performance, ferric/nitric solder stripper with fast tin and tin/lead stripping capability. Easy bath control.

Fast acting. Very high capacity and cost-effective performance. Adding peroxide can increase speed and capacity.

Consistently provides the highest first-pass yields on fine line, high circuit density PCBs…

Thermal cure, screen printable blue etch resist has a medium viscosity with consistent printing performance. Rheology is best suited for polyester mesh screens. Resist withstands cupric and ferric chloride etchants. May be air dried. Alkaline strippable.

Thermal cure resist is alkaline strippable. High solids content, medium viscosity, screen printable, high thixotropy for fine line printing. May be used as either a plating or etch resist. Withstands all acid plating solutions and alkaline or acid etchants. Fast drying.

UV-curable plate and etch resist is specially formulated for acidic and ammoniacal plating processes. Suitable for hand, semi-automatic and high-speed fully automated screen printing operations. Each formulation meets industry requirements for fast, hard cure. Allows for fully aqueous stripping…

Unequaled adhesion to a variety of substrates. One-component, high solids content, epoxy-based resist with matte finish. Screen printable, convection or IR cure. May be used for hole plugging. Easy to use. Meets or exceeds IPC-SM-840B, Class 3 requirements.

High gloss, two-component epoxy based mask. Shorter cure time than one component systems. Screen printable, convection or IR cure. Meets or exceeds IPC-SM-840B, Class 3 requirements.

Screenable formulations for use over copper, tin, and nickel plated circuitry. Provides a tough, protective film that withstands the rigors of HASL. Allows fine tuning of the screening operation to provide the optimum coverage and image resolution. Superb printability in manual, semi-automatic or automatic screening operations. Available in a variety of colors. Meets or exceeds IPC-SM840, Class 3 requirements. UL listed, 94V-0…

Screen printable, designed for solder mask over bare copper applications. The wet film cures in seconds to form a tough, protective film that withstands HASL. Meets or exceeds IPC-SM840, Class 3 requirements. UL listed, 94V-0…

Used and specified by over 200 PCB fabricators and 350 assembler/OEMs worldwide, ENPLATE DSR-3241 LPSMs deliver short cycle times and high yields…

Screen imaged nomenclature ink. Available in black and yellow…

Excellent opacity and printability; high resistance to chemical and soldering processing. Superior adhesion to UV-curable, liquid photoimageble, dry film and thermal cure solder masks. Available in white.

Two component, laser markable, thermal cure ink is available in white or yellow. Superior adhesion to solder mask and laminate substrates. Will withstand multiple heat cycles without yellowing.

One component, epoxy based ink has the highest degree of thermal and chemical resistance. Excellent adhesion to all types of solder masks and other substrates.

Two component, epoxy based ink with a selection of catalysts and a wide latitude in cure schedules-ambient, heat or IR. Screen printing or thinned for spray applications. Available in many colors.

Two component, liquid photoimageable ink is applied by flood screen printing, dried and exposed with phototool in a hard contact mode. Fully aqueous developable process. Available in white.

Concentrated alkali-based stripper for removing cured UV and photoimageable solder resists. Fast acting without attacking epoxy laminate. Free rinsing in warm or cold water.

Alkaline stripper designed to effectively remove fully cured dry film solder mask, most photoimageable solder masks and UV and thermal nomenclature inks from PCBs by dip application. It is especially effective in removing aqueous based solder masks without causing damage to the circuitry or the laminate.

Concentrated alkaline stripper removes cured and uncured solder resists. May also be diluted as a cleaner for resist stripping and ink developer equipment.

Cleaning solution designed specifically for the removal of UV and solvent-based resists from the imagined screen. Compatible with most commonly used emulsions.

Water soluble, biodegradable cleaner removes uncured epoxy-based and acrylic-based solder resists, as well as legend inks from screens, PCBs and equipment without leaving any residue.

Water soluble, non-chlorinated cleaner which dissolves uncured solder mask, legend ink, and screen resists from screens and boards. Slow evaporating rate, economical to use.

High speed, aqueous resist stripper specially formulated for innerlayers.

Sprayable, aqueous-based stripper is ideal for removing innerlayer and outerlayer aqueous films. Strips most alkali soluble dry films. Very low odor; produces an ideal particle size for filtration and is very effective on overplate entrapment.

Cost-effective and fast dry film resist stripper; contains caustic.

High speed, aqueous dry film resist stripper specially formulated for innerlayers.

Most versatile stripper for all resist types; excellent for overplated resist. Spray or immersion formulations.

Aqueous, alkaline stripper may be used on fully aqueous dry film, as well as aqueous and semi-aqueous resists. Contains inhibitors to reduce copper and lead build-up in the solution. Leaves copper surfaces bright and untarnished. PC-4025 is particularly effective at removing entrapped film particles and eliminating shorts.

Alkaline liquid concentrate designed for complete removal of fully aqueous dry film resists. It can be used in spray or immersion systems. Proprietary ingredients reduce metal content and a special anti-tarnish results bright, oxide-free surfaces.

Cost-effective, alkaline liquid concentrate is designed to strip fully aqueous dry film and ink film resists at low operating concentrations. Most suitable for spray applications, the stripper ensures bright, tarnish-free copper surfaces.

Concentrated potassium carbonate developer with built-in additive for clean operation. Economical. Sumps, jets and pH probe kept clean and scale-free.

Concentrated high pH developer with built-in additive. Same unique benefits as MS-1116.

Highly concentrated, ultra-filtered sodium carbonate-based developer for fine line dense circuitry. Easy to use and economical, it is ideally suited for pH or conductivity controlled feed and bleed replenishment systems.

Economical, long lasting, and heat stable. Designed to control foam in aqueous systems, such as resist stripping and developing solutions. Ideal for waste treatment.

Economical solvent-type defoamer for resist stripping or developing.

Inhibitor/defoamer additive for caustic strippers

Defoamer additive for caustic strippers.

Multipurpose defoamer for resist stripper and developer solutions.

Multi-purpose defoamer for waste water treatment, flipper, etc.

You have to convert to a Pb-free process. Yet you can’t afford to sacrifice yields or reliability. The solution. New AlphaSTARTM Immersion Silver. It’s a high yield finish that provides exceptional solder joint strength time after time...

ENTEK PLUS CU-106A (X) HT has been specially formulated to exceed the requirements of today‘s most demanding lead-free assembly processes. Based on the existing and patented ENTEK PLUS technology, this latest innovation provides exceptional solderability through 9 lead-free reflows...

Used and specified by over 250 PWB fabricators and 400 OEM/assemblers, ENTEK PLUS is the world’s leading alternative to hot air solder leveling (HASL)…

Process provides a nickel-gold finish that exhibits a flat, highly solderable surface…

HASL alternative deposits an organo-metallic tin with a modified grained structure that eliminates whisker growth…

High viscosity flux designed for vertical HASL process, including Quicksilver®* level machines. High performance functional fluid ensures superior heat stability and mask protection combined with excellent coverage.
*Quicksilver® is a registered trademark of Cemco Services Ltd., Petersfield, UK.

Low viscosity flux designed for vertical HASL process, especially Quicksilver machines. Total solder coverage on SMD pads. Unique low surface tension properties produce a brilliant finish.

Fully stabilized, low viscosity flux for horizontal HASL process. Chloride activated. Used with AF-1864 oil. Combines exceptional coverage and maximum mask protection with low consumption.

High performance flux specially formulated for horizontal HASL process, especially Alchemy®* machines. Excellent resistance to organic breakdown. Clean running.

*Alchemy® is a registered trademark of Cemco Services Ltd., Petersfield, UK.

High temperature flux specially formulated for use in no-lead HASL with Alchemy HASL machines. Intended for use with ENTHONE HO-2508 oil, the flux also works well in standard Sn/Pb (63/37) HASL with reduced evaporation and smoking.

Low viscosity, non-foaming flux is designed for vertical HASL process. Minimum flux carbonization and low smoking on the molten solder pot surface for reduced equipment maintenance and enhanced PCB quality. Its lower viscosity and increased activity allows the flux to successfully solder-coat difficult to wet closely spaced circuitry on SMT boards.

Hot oil reflow flux is designed for vertical HASL process.

Universal, ultra-low cost flux for use in vertical HASL process. Dip or roller application. Non-foaming.

Used in horizontal HASL equipment requiring re-circulated stable heat transfer fluid for flowing solder on PCBs. Oil is completely water soluble and biodegradable.

Highly stabilized oil for horizontal HASL reduces organic breakdown. Ideally suited for hot oil reflow. Does not freeze under cold conditions. Good mask protection and machine lubrication properties.

High temperature oil developed for use with “no-lead” HASL processing on Alchemy systems. The oil has an extremely high flash point and performs at the elevated temperatures associated with “no-lead” alloys (270 – 290 °C). In standard Sn/Pb HASL process (250 °C), the oil can run in excess of 120 hours at temperature. Produces minimal smoke and emissions.

Removes post-soldering residues of water soluble fluxes. Rapidly removes acids, activators, ionic residues, and flux vehicles without the use of chlorinated hydrocarbons. Economical; used in both spray and immersion equipment.

Specially designed for use in all HASL equipment and is the highest purity HASL bar on the market today. Made with electrolytic refined solder that minimizes dross and metallic impurities. Consistently low trace contamination levels optimizes wetting times. Low surface tension improves bath life and performance. Low operating temperatures yield superior coverage.

Economical ER grade HASL solder. Superior flow and wetting capability. Reclaim program available.

Economical lead-free grade HASL solder. High purity, excellent value. Reclaim program available.

Various alloys of extruded and machine cast plating anodes. Anodes available in chops, Oval, D, flat, star, ball and improved efficiency waffle types.

Medium viscosity flux design for vertical HASL process, including Quicksilver level machines. Total solder coverage on SMD pads. Unique, low surface tension properties produce a brilliant finish.